Manufacturing of Casings and Enclosures for Electronic Equipment
We provide advanced manufacturing solutions for electronic enclosures and casings, guaranteeing the perfect fit of your components from prototype to short run.
At Ineo, we provide advanced manufacturing solutions for the electronics sector and hardware development, combining high-resolution industrial 3D printing, vacuum thermoforming, CNC machining, and vacuum casting, among other technologies.
From functional prototypes for aesthetic and fit validation to the production of short runs and on-demand production of definitive casings (enclosures), we guarantee a precise fit, technical protection, and commercial-level surface finishes. We rigorously adapt to the needs of engineering companies, IoT developers, hardware startups, and electronic equipment manufacturers.
Functional Prototypes
We develop rapid and ultra-precise prototypes of casings for electronic devices, allowing validation of ergonomics, PCB assembly (clipping/screwing), and aesthetics before mass production. We use technologies such as SLA (stereolithography) to achieve transparency and smooth surfaces, perfectly emulating the behavior of final injection plastic, or rapid molds to validate thermoformed parts.
Component Series Production
Our experience in agile manufacturing allows us to produce short, medium, and long runs of casings ready for the market, without needing costly initial investments in steel molds. Through vacuum thermoforming, ideal for lightweight and large-format enclosures, and Multi Jet Fusion (MJF) printing, we guarantee consistent, airtight, mechanically resistant parts ready for electronics integration.
Flexible Production of Short Runs and On-Demand
Our advanced infrastructure is designed to produce short and medium runs of electronic casings efficiently, eliminating the economic barriers of traditional plastic injection. Thanks to the combined use of industrial additive technologies, CNC machining, and thermoforming, we can manufacture custom batches adapted to your project's actual volume, facilitating design modifications between series without financial penalties. It is the ideal solution for launching initial commercial series, specific IoT devices, or regular hardware updates.
Co-Design, Product Engineering, and DFM Optimization
At Ineo, we don't just manufacture; we integrate into the development phase from our technical office in Terrassa (Barcelona). We offer a co-design and DFM (Design for Manufacturing) optimization service, analyzing your CAD files to ensure the casing design is fully viable for vacuum thermoforming, machining, vacuum casting, or 3D printing. We adjust thicknesses, draft angles, and critical tolerances to optimize production costs, accelerate delivery times, and ensure hardware and enclosures integrate impeccably from the first batch.
Applied Technologies
We apply advanced technologies to maximize the precision, tightness, and cost efficiency of your devices:
Industrial 3D Printing
SLS, SLA, MJF, and FDM for complex, transparent, flexible casings or ones with high thermal and structural resistance.
Vacuum Thermoforming
The most efficient technology for manufacturing thin casings, large-format medical or industrial equipment covers, and special logistics trays from thermoplastic sheets.
High-Precision CNC Machining
For aluminum metal enclosures (heat dissipation), machining of technical plastic plates, and fixing posts.
Vacuum Casting and Silicone Molds
The ideal technology for short runs (10 to 100 units) with properties identical to plastic injection (ABS/Polycarbonate).
Certificate ISO 9001:2015
Registration Number: 0.04.18119
TÜV Rheinland Ibérica Inspection, Certification & Testing S.A.
Sector Benefits
Rapid validation of functional prototypes and PCB fits (Form & Fit test).
Volume flexibility: From unique 3D printed prototypes to medium and long runs via vacuum thermoforming.
ESD material usage: Capability to manufacture components and trays with technical plastics that dissipate static electricity to protect circuits.
Drastic cost reduction in tooling when using optimized molds for thermoforming or casting compared to traditional injection.
Time-to-Market acceleration in hardware, IoT, consumer, and industrial electronics projects.
Use Cases / Applications
Custom boxes for sensors, IoT devices, and communication nodes.
Large covers and casings for medical machinery, interactive kiosks, and laboratory equipment manufactured by thermoforming.
Transport trays and technical antistatic (ESD) blisters for the safe handling of circuit boards during assembly.
Visual and transparent models (SLA) for trade shows, light guide validations, or internal component inspection.
Frequently Asked Questions (FAQs)
Get your technical questions answered about our manufacturing processes.
Vacuum thermoforming is especially suitable for the electronics sector for two reasons: it allows large exterior casings and covers to be manufactured very economically compared to injection molds, and it is the ideal technology for processing technical plastics with antistatic (ESD) properties, perfect for manufacturing transport trays that protect sensitive electronic components from electrostatic discharges.
Do you need to accelerate your device's launch and ensure the perfect fit for your electronics?
Optimize your casings and enclosures with advanced manufacturing.
Contact our industrial manufacturing experts for electronics and hardware engineering and discover how we can accelerate your prototypes, manufacture your series via 3D printing or vacuum thermoforming, and offer you customized solutions with the highest market precision.
INEO PROTOTIPOS S.L.
C/Avenc del Daví, 6 Pol.Ind.Can Petit
Terrassa, Barcelona 08227
Tel. +34 937 337 000
Email: contact@ineo.es
Web: https://www.ineo.es